
Ultrasonic Circuit Board
Jiayuanda technology dual frequency ultrasonic generator circuit board is mainly used for manufacturing 28kHz, 40khz/40khz, 80khz/40khz, 80khz, 120khz ultrasonic dual frequency cleaning machine and ultrasonic triple frequency cleaning equipment
Jiayuanda technology dual frequency ultrasonic circuit board is mainly used for manufacturing 28kHz, 40khz/40khz, 80khz/40khz, 80khz, 120khz ultrasonic dual frequency cleaning machine and ultrasonic triple frequency cleaning equipment
Ultrasonic Circuit Board Specification:
Model | JYD-1600C | JYD-400X | JYD-301EC | JYD-302EC | JYD-600GC |
Working frequency | 25/28/33/40Khz | 28/40Khz | 25/28/33/40Khz | 25/28/33/40Khz | 53-130KHz |
40/80Khz | |||||
40/80/120Khz | |||||
Ultrasonic power | 900W | 600W | 300W | 600W | 600W |
Working current | 3.0A | 1.8A | 1.0A | 2.0A | 1.5A |
Product dimension | 210*190*88mm | 210*190*88mm | 210*190*88mm | 210*190*88mm | 210*190*88mm |
Power supply:220V±10% 110V±10% 50/60Hz | |||||
The advantages of ultrasonic cleaning are as follows:
High precision: because ultrasonic can penetrate tiny cracks and holes, when the parts to be cleaned are precision parts, ultrasonic cleaning usually meets its special technical requirements.
Fast: ultrasonic cleaning is much faster than the traditional cleaning method in removing the dust on the workpiece. It can clean components without disassembly, saving labor, which is usually called the most economical cleaning method;
Highly cleaning: no matter what the size of the parts to be cleaned, or the need for centralized cleaning on the automatic assembly line, ultrasonic cleaning can achieve uniform cleaning unmatched by manual cleaning
FAQ:
Q: What about megasonic cleaning technology?
Megasonic cleaning technology is a representative of ultra precision cleaning. Nano cleaning technology plays an important role in the field of semiconductor cleaning, and it has become a leading dark horse in the field of precision cleaning. It can also efficiently clean silicon wafer, gallium arsenide, liquid crystal glass, etc., and Ultra Precision Clean brittle materials such as hard disk, read-write head, semiconductor components, thin film head, etc. At the same time, it can handle precision cleaning in advanced packaging fields, such as TSV post etching cleaning and ubm/rdl bonding cleaning. With the deepening of research, megasonic cleaning technology has been more and more applied in the production of semiconductors and electronic devices, and has also attracted people's attention in the precision cleaning of optical devices and medical equipment.
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